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failure analysis or npi staff engineer (wire-bond, flip-chip).

job details

summary

    job details

    New Product Introduction (NPI)

    • To perform qualification on semi-conductor packaging equipment through verification of machine calibration, setup and process bonding on semiconductor packaging equipment
    • Identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time
    • Develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) for manufacturing usage
    • Recommend enhancements to process recipes, process tooling or manufacturing processes to ensure excellent manufacturing process coverage of semiconductors packaging equipment to their bonding functionalities Establish PFMEA process testing for customized kits to ensure machine is performing to customer’s requirements
    • Ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes
    • Setup and real-time monitoring of critical manufacturing processes with abnormally detection criterions and/or SPC
    • Training and skillset profiling of assembly technicians


    Failure Analysis

    • Manage and drive customer quality and reliability requirements
    • Ensure timely and accurate identification of failures by performing characterization of failures, part analysis and fault isolation. Such investigations can be on mechanical, electrical, process, and/or system level, on part level or machine level
    • Use methodologies such as FEMA, DOE, Fish Bone, 8D, and data analytics tools such as Advanced Microsoft Excel, Tableau when carrying out root cause investigations
    • Perform failure analysis and root cause investigations; communicate status and results to customers and internal stakeholders through verbal communication and written documents
    • Provide timely troubleshooting support to field engineers in helping to identify and rectify product/process failures timely
    • Serve as a liaison between customer, field engineers and internal stakeholders on quality and reliability issues
    • Manage closed loop corrective action for quality and reliability issues
    • May need to travel occasionally on short notice to customer location for troubleshooting and problem resolution

    Requirements

    • Degree in Engineering (Materials Science, Electrical or Mechanical) with 5 years of related experience
    • Possess strong statistical analysis skillset with demonstrated ability to conduct design-of-experiment
    • Experience in process development of bonding processes (Wiring Bonding, Die-Bonding or Thermocompression Bonding or Flip Chip) is needed

    If you are interested in the position , kindly send your CVs to sean.ho(@)randstad.com.sg

    Please include your availability, expected salary and reason for leaving your current job.

    We regret that only shortlisted candidates will be contacted.
    Applicants must be fully vaccinated or have a valid exemption in accordance with MOM’s regulations to allow them to enter the workplace. Applicants may be required to share verifiable COVID-19 vaccination documents or proof of a valid exemption at the point of offer. Randstad Pte. Limited and/or the Client reserves the right to withdraw an offer if the applicant fails to provide verifiable COVID-19 vaccination and/or proof of exemption documents.

    EA: 94C3609 / Reg: R21103172

    New Product Introduction (NPI)

    • To perform qualification on semi-conductor packaging equipment through verification of machine calibration, setup and process bonding on semiconductor packaging equipment
    • Identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time
    • Develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) for manufacturing usage
    • Recommend enhancements to process recipes, process tooling or manufacturing processes to ensure excellent manufacturing process coverage of semiconductors packaging equipment to their bonding functionalities Establish PFMEA process testing for customized kits to ensure machine is performing to customer’s requirements
    • Ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes
    • Setup and real-time monitoring of critical manufacturing processes with abnormally detection criterions and/or SPC
    • Training and skillset profiling of assembly technicians


    Failure Analysis

    • Manage and drive customer quality and reliability requirements
    • Ensure timely and accurate identification of failures by performing characterization of failures, part analysis and fault isolation. Such investigations can be on mechanical, electrical, process, and/or system level, on part level or machine level
    • Use methodologies such as FEMA, DOE, Fish Bone, 8D, and data analytics tools such as Advanced Microsoft Excel, Tableau when carrying out root cause investigations
    • Perform failure analysis and root cause investigations; communicate status and results to customers and internal stakeholders through verbal communication and written documents
    • Provide timely troubleshooting support to field engineers in helping to identify and rectify product/process failures timely
    • Serve as a liaison between customer, field engineers and internal stakeholders on quality and reliability issues
    • Manage closed loop corrective action for quality and reliability issues
    • May need to travel occasionally on short notice to customer location for troubleshooting and problem resolution

    Requirements

    • Degree in Engineering (Materials Science, Electrical or Mechanical) with 5 years of related experience
    • Possess strong statistical analysis skillset with demonstrated ability to conduct design-of-experiment
    • Experience in process development of bonding processes (Wiring Bonding, Die-Bonding or Thermocompression Bonding or Flip Chip) is needed

    If you are interested in the position , kindly send your CVs to sean.ho(@)randstad.com.sg

    Please include your availability, expected salary and reason for leaving your current job.

    We regret that only shortlisted candidates will be contacted.
    Applicants must be fully vaccinated or have a valid exemption in accordance with MOM’s regulations to allow them to enter the workplace. Applicants may be required to share verifiable COVID-19 vaccination documents or proof of a valid exemption at the point of offer. Randstad Pte. Limited and/or the Client reserves the right to withdraw an offer if the applicant fails to provide verifiable COVID-19 vaccination and/or proof of exemption documents.

    EA: 94C3609 / Reg: R21103172