senior / process engineer (wafer bumping & bonder) in Singapore

posted
contact
yit wei kwan, randstad
job type
permanent

job details

posted
location
singapore
specialism
manufacturing & production
job type
permanent
working hours
Full-Time
experience
4 years
reference number
91M0157472_1624235331
contact
yit wei kwan, randstad
phone
65103642
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job description

about the company

My client designs and manufactures of equipment, precision components. As a result of ongoing and continued success in both Singapore & internationally, they are recruiting for talented candidates to join them for their expansion.

about the job

  • Work on device qualifications / applications and generate suitable processes to meet or exceed customer requirements
  • Engage and represent the company in equipment benchmarking to highlight the machine’s overall capability
  • Develop test plans
  • Support customers in technical training during new product or process introductions, equipment process buyoff and post-sales process troubleshooting
  • Provide advice on packaging design
  • Set-up transfer molding processes

skills & experience required

  • Bachelors’ degree in Physics / EEE / Material Science / Mechanical Engineering
  • Minimum 4 years of experience in semiconductor backend manufacturing environment
  • Material knowledge on either Gold / Copper wire, substrates and lead frames / wafers will be a plus
  • Ability to read simple mechanical drawings
  • Proficient in Design of Experiments techniques
  • Hands on with Ball / wedge Bonder / wafer bumping related equipment

If you are interested in the position , kindly send your CVs to yitwei.kwan(@)randstad.com.sg

Please include your availability, expected salary and reason for leaving current job.

We regret that only shortlisted candidates will be contacted

EA: 94C3609 / Reg: R1325913

skills

process engineer

qualification

Degree

educational requirements

Bachelor Degree