Job opening - Staff/Snr/ Packaging Design Engineer (WLCSP / BGA / Fanout)x2 in Singapore | Randstad Singapore

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summary

singapore
randstad pte limited
S$5,000 - S$8,500 per month
permanent
full-time

specialism
manufacturing & production
sub specialism
manufacturing
reference number
91M0205127_1669613129704130135

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job details

Key Responsibilities

Generate, update, and revise electrical routing layout based on the design provided by external customers.
Generate test vehicle design and the related PCB design.
Prepare design risk assessment report.
Generate reticle and stencil design.
Generate other schematics or drawing as requested.
Review, maintenance and update the design guidelines.
Manage the conversion of internal design into suppliers’ final design.
Document all the drawing revisions and change records.
Support audits

Requirement ...

5~10 years of relevant hand-on experience.
Good understanding of wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB, etc.
Good understanding on design guidelines and risk assessment.
Familiar with other design software (Linkcad, CAM350, AutoCAD, GDS editor and Gerber editors)
Familiar with PCB test board design.
Knowledge and understanding of wafer-level process and product reliability.
Knowledge in other packaging assembly process will be the advantage.

We regret that only shortlisted candidates will be contacted EA: 94C3609 / Reg: R22105422

Applicants must be fully vaccinated or have a valid exemption in accordance with MOM’s regulations to allow them to enter the workplace. Applicants may be required to share verifiable COVID-19 vaccination documents or proof of a valid exemption at the point of offer. Randstad Pte. Limited and/or the Client reserves the right to withdraw an offer if the applicant fails to provide verifiable COVID-19 vaccination and/or proof of exemption documents.

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Key Responsibilities

Generate, update, and revise electrical routing layout based on the design provided by external customers.
Generate test vehicle design and the related PCB design.
Prepare design risk assessment report.
Generate reticle and stencil design.
Generate other schematics or drawing as requested.
Review, maintenance and update the design guidelines.
Manage the conversion of internal design into suppliers’ final design.
Document all the drawing revisions and change records.
Support audits

Requirement

5~10 years of relevant hand-on experience.
Good understanding of wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB, etc.
Good understanding on design guidelines and risk assessment.
Familiar with other design software (Linkcad, CAM350, AutoCAD, GDS editor and Gerber editors)
Familiar with PCB test board design.
Knowledge and understanding of wafer-level process and product reliability.
Knowledge in other packaging assembly process will be the advantage.

We regret that only shortlisted candidates will be contacted EA: 94C3609 / Reg: R22105422 ...

Applicants must be fully vaccinated or have a valid exemption in accordance with MOM’s regulations to allow them to enter the workplace. Applicants may be required to share verifiable COVID-19 vaccination documents or proof of a valid exemption at the point of offer. Randstad Pte. Limited and/or the Client reserves the right to withdraw an offer if the applicant fails to provide verifiable COVID-19 vaccination and/or proof of exemption documents.

show more

experience
5 years
skills
no additional skills required
qualifications
no additional qualifications required
education
Bachelor Degree

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