Job opening - Device / Process Integration / Process & Equipment Engineering in Singapore | Randstad Singapore

summary

singapore
permanent
full-time

specialism
manufacturing & production
sub specialism
manufacturing
reference number
91M0274295_5168187129704114358

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job details

Process & Equipment Engineering (Dry Etch & CMP)

Leadership (Directors/Sr. Managers): Define the strategic roadmap for Etch/CMP modules. Manage large teams of engineers, oversee budget/capex planning, and drive cross-functional initiatives for yield improvement and technology transfers.
Technical Experts (Principal roles): Lead advanced process development, tool qualification, and troubleshooting. Optimize equipment uptime, drive defect reduction, and implement robust APC/SPC control strategies.

Device, Integration & Reliability (Device, PIE, WLR)

Device & PIE: Lead technology node development and continuous improvement. Design experiments (DOE) to optimize device performance, target electrical parameters, and resolve yield-limiting bottlenecks. Drive specialty technology roadmaps in High Voltage (HV), BCD, Silicon Photonics (SiPh), RF, or Non-Volatile Memory (NVM).
Reliability: Develop and execute Wafer Level Reliability (WLR) test methodologies. Ensure new technologies meet stringent automotive and consumer reliability standards (HCI, NBTI, TDDB, EM).

Customer Engineering & Program Management (TPM)

Act as the primary technical bridge between our foundry operations and global fabless customers.
Manage complex tape-out schedules, align cross-functional teams (R&D, Yield, Manufacturing), and resolve technical escalations to ensure successful product ramps.

...

Process & Equipment Engineering (Dry Etch & CMP)

Leadership (Directors/Sr. Managers): Define the strategic roadmap for Etch/CMP modules. Manage large teams of engineers, oversee budget/capex planning, and drive cross-functional initiatives for yield improvement and technology transfers.
Technical Experts (Principal roles): Lead advanced process development, tool qualification, and troubleshooting. Optimize equipment uptime, drive defect reduction, and implement robust APC/SPC control strategies.

Device, Integration & Reliability (Device, PIE, WLR)

Device & PIE: Lead technology node development and continuous improvement. Design experiments (DOE) to optimize device performance, target electrical parameters, and resolve yield-limiting bottlenecks. Drive specialty technology roadmaps in High Voltage (HV), BCD, Silicon Photonics (SiPh), RF, or Non-Volatile Memory (NVM).
Reliability: Develop and execute Wafer Level Reliability (WLR) test methodologies. Ensure new technologies meet stringent automotive and consumer reliability standards (HCI, NBTI, TDDB, EM).

Customer Engineering & Program Management (TPM)

Act as the primary technical bridge between our foundry operations and global fabless customers.
Manage complex tape-out schedules, align cross-functional teams (R&D, Yield, Manufacturing), and resolve technical escalations to ensure successful product ramps.

skills
no additional skills required
qualifications
no additional qualifications required
education
Bachelor Degree

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sean ho

+65 6510 7417

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