The Process OR Equipment Technical Manager plays a pivotal role in driving technical excellence, tool performance, and continuous yield and process improvement across semiconductor manufacturing platforms.
This role leads a team of high-performing engineers and technicians to ensure maximum equipment uptime, process stability, and successful integration of new process technology releases (NPI). The manager acts as a primary technical escalation point, bridging cross-functional gaps between R&D, manufacturing operations, quality, and vendor support.
Key Responsibilities1. Technical Leadership & Operational Oversight
- Lead, coach, and manage a team of Process and Equipment Engineers across wafer fab production lines.
- Oversee tool installation, hookup, commissioning, and Acceptance Test Procedures (ATP) for new equipment ramps.
- Establish and enforce standard operating procedures (SOPs), preventive maintenance (PM) schedules, and equipment baseline guidelines to maintain tool stability.
- Oversee complex troubleshooting, root-cause failure analysis, and hardware/recipe recovery during major tool down events or process excursions.
2. Yield Enhancement & Process Optimization
- Drive Continuous Improvement Projects (CIP) to optimize tool overall equipment effectiveness (OEE), cost of ownership (CoO), cycle time, and material consumption.
- Collaborate with Process Integration and Yield Engineering teams to identify defect density root causes, implementing robust Statistical Process Control (SPC) and Advanced Process Control (APC) models.
- Direct Failure Mode and Effects Analysis (FMEA) reviews and 8D/CAR problem-solving methodologies to eliminate systemic defect excursions.
3. Technology Transfer & New Product Introduction (NPI)
- Lead technology transfer initiatives from R&D to high-volume manufacturing (HVM), ensuring tool readiness, qualification, and process matching.
- Partner with equipment OEMs to evaluate hardware/software upgrades, engineering change orders (ECOs), and vendor service quality.
4. Team Management & Resource Allocation
- Plan and manage departmental headcount, budget, spare parts inventory (BOM), and training roadmaps for engineering staff.
- Foster a culture of safety (EHSS), operational discipline, and continuous technical learning.
Education
- Bachelor’s, Master’s, or Ph.D. in Electrical/Electronic Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related discipline.
Experience
- 8+ years of hands-on process or equipment engineering experience in semiconductor wafer fabrication or Tier-1 equipment OEM environments.
- At least 2–3 years in a technical leadership, team lead, or managerial role.
- Direct background in tool maintenance, process qualification, and failure recovery on semiconductor manufacturing platforms.
- Technical Problem-Solving: Advanced knowledge of 8D methodology, FMEA, SPC, DOE (Design of Experiments), and data analysis tools (JMP, Minitab).
- Equipment Knowledge: Proficiency in electromechanical, pneumatic, vacuum, RF power, and automation systems.
- Leadership & Stakeholder Management: Demonstrated ability to manage high-pressure operational environments, resolve cross-departmental bottlenecks, and interface effectively with executive management and external customers.
