Key ResponsibilitiesProcess Development & OptimizationLithography & Coating: Own development for advanced packaging, focusing on repeatability and high yield for panel-level solutions.Plating & CMP: Set up and qualify equipment for surface finishing, immersion plating, and planarization of metal/dielectric layers (e.g., copper, ABF, PI).Innovation: Lead efforts in process cost reduction, cycle time improvement, and yield enhancement through innovative proc
Key ResponsibilitiesProcess Development & OptimizationLithography & Coating: Own development for advanced packaging, focusing on repeatability and high yield for panel-level solutions.Plating & CMP: Set up and qualify equipment for surface finishing, immersion plating, and planarization of metal/dielectric layers (e.g., copper, ABF, PI).Innovation: Lead efforts in process cost reduction, cycle time improvement, and yield enhancement through innovative proc
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