Key Responsibilities
- Develop and validate predictive simulation models to represent the complex physics and chemistry of the slit coating and CMP processes
- Analyse simulation outputs to identify potential issues like erosion, dishing, and delamination, providing actionable recommendations to improve yield and coating quality
- Optimize tool and process parameters—such as coating speed, die gap, slurry composition, and pad conditioning—to achieve planarization targets and identify stable operating windows
- Utilize advanced CFD and simulation software to analyze fluid flow, material removal rates (MRR), defect formation mechanisms, and topography evolution
Qualifications
- Master’s or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Physics, or a related field with a strong focus on computational modelling or fluid dynamics
- MIn 5 years of proven experience using simulation tools for complex engineering problems in the semiconductor industry, specifically involving CMP, fluid dynamics, or surface finishing/coating processes
- Hands-on experience with commercial simulation packages (COMSOL Multiphysics, ANSYS Fluent/Mechanical) and programming/scripting languages (Python, MATLAB, or C++) for data analysis
- Familiarity with semiconductor fabrication processes, particularly dual damascene architecture, copper interconnects, and properties of organic dielectric materials
- Must be able to work in the West of Singapore
Please include your availability, expected salary and reason for leaving current job
We regret that only shortlisted candidates will be contacted
EA: 94C3609 / Reg: R1325913
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